EMC PCB Design and Integration Training

If you are a design or compliance engineer, it pays for you to know how and why EMI testing is conducted, as well as the typical causes of failure. EMC PCB Design and Integration Training offer all of the EMI information you’ll need to design compliant Printed Circuit Boards (PCBs)—including design considerations at CAE and CAD levels—for you to provide a compliant radiation/susceptibility product. You’ll examine ways to prevent common EMI/EMC problems regarding power supplies, cables, connectors, slots, discontinuity of ground planes, and more.

This three-day EMC PCB Design and Integration Training class will focus on EMI and RFI issues regarding PCBs, computers, analog designs, and systems, along with relevant EMI regulations in the U.S., the European Union, and Asia. Highlights include PCB radiation basics, radiation and bypass on PCBs, PCB radiation suppression techniques, grounding designs/filtering, crosstalk/termination, power, and ground planes, antenna loops, spread spectrum clocking, and differential-mode and common-mode radiation. Enclosure and supplemental control techniques are presented as a part of the design where the PCB control measures are restricted.

• Electromagnetic Environmental Effects (E3) for Space Systems Training
• Electronic Packaging Training
• EMC and Signal Integrity Training
• EMI/EMC in Military Systems Training
• EMI/EMC in Systems & Facilities Training
• Essentials of Digital Technology Training
• Essentials of Electronic Technology Training

• FUNDAMENTALS
  Frequency, time, and distance; are lumped versus distributed systems, four kinds of reactance, ordinary and mutual capacitance, and inductance.
• EMI CONCERNS
  EMI, source, path, and receptor; threats, EMI issues, EMI regulations.
• CONDUCTING A COMPLIANCE TEST WITH EMPHASIS ON THE PCB AND ENCLOSURE
  Conducted emissions, radiated emissions, RF immunity, conducted RF immunity, ESD, lightning, electrical fast transient, shock, and EMP.
• EMI DESIGN REQUIREMENTS FOR PCBs
  Interference coupling mechanism, CM radiation, antenna loops, basics of PCB radiation, PCB suppression techniques, design for immunity, switching mode power supplies (SMPS)
• DESIGN CONSIDERATIONS FOR EMI COMPATIBILITY
  Crosstalk – inductive/capacitive, forward/backward – how does it occur? Why does it cause radiation how is it minimized? Picket fences, Cu fills, spread spectrum clocking, bypass, and radiation on PCBs, Near/Far field, differential/common coupling modes and resonance, analog circuitry.
• POWER DISTRIBUTION AND GROUNDING
  Power/ground planes why do they cause radiation and how is it minimized? Splits, slots, moats, floats, drawbridge, how to design for minimizing emissions from power/ground planes. How to design for digital/analog (multi-bias) and single-bias PCBs. Ideal stack-ups to be EMC.
• CABLES/CONNECTORS AND PCB, CONCERNS OF PCBs INTERFACING WITH FILTERING AND SHIELDING
  Capacitive and magnetic shielding, slots in PCBs, shield grounding, cable radiation, shielding types, transfer impedance, and shielding connection.
• ENCLOSURES, MOTHERBOARDS, BACKPLANES, AND BLADES
  Loss of PCB ground plane in cables, how to design a PCB land trace to a connector pin to eliminate reflections, cable configuration, antenna loops with cable connections, and high-speed connectors. EMC PCB Design and Integration Training
• FILTERING AND SHIELDING
  Shielding versus filtering, using ferrites, filtering mains supply, using transients suppressors on mains and I/O lines, radiation through shields.
• BACKPLANE LAYOUT CONCERNS
  Effects of source and load impedance and why mismatches cause radiation, the capacitive load: Zo and propagation delay and radiation effects, 90o, 45o bends, guard traces, interplane capacitance, via discontinuity and vias resonance concerns, back drilling vias.
• BUSSES AND DIFFERENTIALS
  Multidrop systems, drivers, transceivers, and designing a high-speed bus, attributes/drawbacks of loosely/tightly coupled differential pairs, differential impedance, advantages and disadvantages of edge (side by side), broadside (dual), asymmetric, and microstrip differentials; reflections and crosstalk in differentials, matching electrical lengths.
• HIGH-SPEED CLOCKING
  Clock, skew, and jitter, the effects of ISI, skin, and dielectric losses; the effect of various base materials of long-haul transmission, a real-world example of compensation techniques.
• APERTURES, WAVELENGTHS, ABSORPTION MATERIALS, AND HEAT SINKING
  The major concern today is the aperture openings versus the frequency of signals versus the higher density packaging, i.e. ICs are running hotter and the ever-increasing signal edge rate. This leads to more radiation through the apertures, i.e. lambda is shorter, but more heat is generated because Power = C times F times V2. What’s new in enclosure absorption materials and what are their capabilities for minimizing radiation? What’s new in heat sink materials (backplanes, blades, servers) which in turn alleviate the need for heat conduction through the apertures? These current issues will also be covered in the course.

EMC PCB Design and Integration Training Course Recap, Q/A, and Evaluations